ASML’s $400 Million High NA Machine Revolutionizes Chipmaking Amid Global Challenges

Veldhoven, Netherlands, May 26, 2025 — In a high-security laboratory in Veldhoven, Netherlands, ASML, the world’s leading supplier of photolithography equipment, has unveiled a groundbreaking $400 million High Numerical Aperture (High NA) Extreme Ultraviolet (EUV) machine, redefining the future of microchip production. This cutting-edge technology, a decade in development, is transforming the semiconductor industry by enabling the creation of smaller, faster, and more efficient chips critical for advanced technologies like artificial intelligence, autonomous vehicles, and next-generation smartphones.

With only a handful of these massive machines shipped globally, ASML’s innovation solidifies its monopoly in the EUV market, but looming geopolitical tensions and trade policies pose challenges to its complex supply chain.

The Power of High NA EUV Technology

ASML’s High NA EUV machine, roughly the size of a double-decker bus, represents the pinnacle of chipmaking innovation. Unlike its predecessors, which use deep ultraviolet (DUV) lithography with a 193-nanometer wavelength, the high NA EUV employs a 13.5-nanometer wavelength to etch intricate patterns onto silicon wafers. The machine’s larger lens opening, or higher numerical aperture, captures more light at steeper angles, allowing chipmakers to project nanoscopic designs in fewer steps.

This results in chips with transistors as small as 2 nanometers, significantly boosting processing power and energy efficiency. According to ASML’s executive vice president of technology, Jos Benschop, “High NA means two things: shrink and yield. More devices fit on a single wafer, and more chips are usable due to higher resolution.”

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Impact on Global Chipmakers

The High NA EUV machine is a game-changer for industry giants like Intel, TSMC, and Samsung, who rely on ASML’s equipment to produce the world’s most advanced chips. Intel, the first to receive a high-NA machine in early 2024, reported at a February 2025 conference that it processed 30,000 wafers with the machine, achieving twice the reliability of previous EUV models. Samsung noted a 60% reduction in cycle time, enabling faster chip production. TSMC, which received its first High NA machine in Q4 2024, plans to use it for its angstrom 10 (A10) technology, targeting production post-2030.

These advancements are critical for companies like Nvidia, Apple, and AMD, whose cutting-edge GPUs, iPhones, and processors depend on ASML’s technology to meet the demands of the AI boom and beyond.

Did You Know?
ASML’s High NA EUV machine requires 457,329 components, weighs 180 tons, and takes three Boeing 747s to transport, making it one of the most complex machines ever built

Geopolitical and Tariff Challenges

Despite its technological dominance, ASML faces uncertainties due to global trade dynamics. U.S. tariffs, recently announced by President Donald Trump, impose a 20% levy on goods from the European Union, potentially increasing the cost of High NA machines to over $400 million for U.S.-based customers like Intel and TSMC’s American facilities. While semiconductors are exempt, the lack of clarity on chipmaking equipment raises concerns about supply chain disruptions.

ASML’s significant reliance on China, which accounted for a substantial portion of its 2024 sales, is further complicated by U.S.-driven export restrictions that have blocked EUV machine sales to Chinese firms since 2019. These restrictions, extended to DUV machines in 2023, limit ASML’s market access, prompting the company to navigate a delicate balance between geopolitical pressures and commercial interests.

Future Innovations and U.S. Expansion

ASML is already looking ahead to its next innovation, the Hyper NA EUV machine, expected to debut between 2032 and 2035 with an estimated cost of $700 million per unit. CEO Christophe Fouquet emphasized that Hyper NA’s optical designs are in progress, promising even greater precision for future chip generations. To support U.S. growth, ASML is constructing its first U.S. training center in Arizona, set to open in 2025, with a capacity to train 1,200 engineers annually on EUV and DUV systems.

This move aligns with the U.S.’s push to bolster domestic chip production through initiatives like the CHIPS Act, which has fueled investments in facilities by Intel and TSMC. However, the global nature of ASML’s supply chain, reliant on German optics from Zeiss and Japanese chemicals, underscores the challenges of achieving complete technological sovereignty.